ThermaCool™
Thermal Management Product Overview
Saint-Gobain Performance Plastics,
Composites Group (formerly Films, Foams and
Fabrics)
The ThermaCool™ product
line provides cost effective, high performance
solutions to heat transfer needs in many
electrical or electronic applications. From
microprocessors to high power switchgear,
ThermaCool products provide effective heat
transfer solutions in a wide range of
applications.
Our thermal management
products are designed to provide an effective path
for heat dissipation with minimal complication to
the manufacturing process. In order to accomplish
this, Saint-Gobain utilizes over 50 years of tape
manufacturing experience to design thermal
interfaces with creative materials and quality
constructions that will deliver maximum
performance. The result is a product line that
balances the maximum thermal performance in a
cost-effective form. Maximum thermal performance
of a system is critical to optimize the processing
speed and the expected life of modern
microprocessors and becomes even more crucial as
the power of microprocessors and the power density
of computer assemblies continue to increase. If a
microprocessor is insufficiently cooled, it will
operate at speeds lower than it is capable of. In
addition, when a microprocessor is exposed to
elevated temperatures for extended time periods,
its operating life will be decreased or it can
even be destroyed. Computer designers no longer
need to sacrifice the thermal reliability of their
systems in order to simplify the assembly process.
Saint-Gobain allows designers to incorporate the
necessary thermal interface while keeping their
assembly costs to a minimum. This combination can
produce a reliable system at a very competitive
cost.
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